Aamir Shahzad
Beko Global
Turkey
ConferenceEngineering And Technology
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
47Days
00Hours
41Minutes
32Seconds
IC-EPAE
Wed, Jul 22, 2026- Thu, Jul 23, 2026
Hammamet, Tunisia
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
IC-EPAE
Wed, Jul 22, 2026- Thu, Jul 23, 2026
Hammamet, Tunisia
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Objective of the Conference
International Conference on Electronics Packaging and Assembly Engineering is an organization dedicated to support professionals across all fields and countries through strategically designed activities, including international conference organization and journal publications. It also provides access to critical resources and aids global policymaking. It ultimately aims to facilitate learning, networking, and innovation for faculty, students, professionals, and policymakers from any domain.
Important Dates
Start Date
Wednesday, July 22, 2026
End Date
Thursday, July 23, 2026
Registration Deadline
Tuesday, July 7, 2026
Submission Deadline
Thursday, July 2, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
