Dejan Tanikic
University of Belgrade
Your Place
ConferenceEngineering And Technology
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
26Days
04Hours
54Minutes
39Seconds
IC-EPAE
Wed, Jul 1, 2026- Thu, Jul 2, 2026
Toronto, Canada
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
IC-EPAE
Wed, Jul 1, 2026- Thu, Jul 2, 2026
Toronto, Canada
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Objective of the Conference
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Important Dates
Start Date
Wednesday, July 1, 2026
End Date
Thursday, July 2, 2026
Registration Deadline
Tuesday, June 16, 2026
Submission Deadline
Thursday, June 11, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
